Note:

Do not use liquid metal for aluminum radiators!

Please confirm your operational ability before purchase, because it is risky to replace

liquid gold!

please do a good job around the insulation protection before daub, just in case,

remember!This shop is not responsible for the computer failure caused by the

replacement of liquid gold.

A convenient syringe makes this Liquid Metal very easy to apply and goes exactly where it should be: on the CPU Cooler, GPU Cooling or heat dissipation rib plates

Thanks to long tests, Conductonaut has a very high thermal conductivity and excellent stability even with prolonged use. Due to its composition, it cannot be applied to aluminum components as it will cause corrosion.

A popular choice for very experienced PC builders because of its extreme heat dissipation, but also because it conducts electricity!

Conductonaut Must not be used in conjunction with aluminum as it can permanently damage the surface and can be used directly on copper or silicon.

LK-128 Conductonaut is a liquid metal thermal compound based on a eutectic alloy. Our special mixture of metals like tin, gallium and indium, Conductonaut excels with a very high thermal conductivity. We recommend to apply Conductonaut on nickel plated surfaces since this will provide the best long term stability in performance.

Conductonaut is a liquid metal thermal paste developed for high efficiency applications. Conductonaut is recommended as the best product for experienced users who are looking for a solution with the best heat dissipation in the temperature range from over 8 ° C, but also through the risk of electric conduction.

Description: LK-128 is a high performance liquid metal themal compound.

Properties: LK-128 liquid metal thermal compound is based on a eutectic alloy. A special combination of metals like tin, gallium and indium results in very high thermal conductivity and excellent long-term stability.

Application: LK-128 is recommended for applications that require extremely high thermal conductivity at room temperature – e.g. between a silicon chip PC microprocessor and heat sink. The liquid metal compound compensates even the slightest irregularities, which can not be achieved with convenstional thermal greases.